Latest Headlines

  1. WISeKey Razor And Blade Cybersecurity Business Model Is Accelerating The Commercialization Of Its Semiconductor Products

    WISeKey International Holding Ltd (WISeKey) (SIX:WIHN), a leading Swiss cybersecurity and IoT solutions company, announced today that its razor and blade cybersecurity business model is accelerating the commercialization of its semiconductor products with embedded security

  2. Renesas Electronics Ships Space Industry’s First Radiation-Hardened 100V And 200V GaN FET Power Supply Solutions

    Renesas Electronics Corporation , a premier supplier of advanced semiconductor solutions, recently announced the space industry’s first radiation-hardened, low side Gallium Nitride (GaN) field effect transistor (FET) driver and GaN FETs that enable primary and secondary DC/DC converter power supplies in launch vehicles and satellites, as well as downhole drilling and high reliability industrial applications

  3. Unigroup Spreadtrum & RDA Collaborates With Google's GMS Express Program

    Unigroup Spreadtrum & RDA, a world's leading fabless semiconductor company with advanced technology in mobile communications and IoT, recently announced their official collaboration with Google on the GMS Express program

  4. ABLIC Introduces The World's Smallest Automotive 150mA LDO Regulators S-19251 Series

    ABLIC Inc. (ABLIC) that manufactures and sells semiconductor products recently announced the launch of S-19251 Series, the world’s smallest automotive LDO regulators

  5. MACOM And STMicroelectronics To Bring GaN On Silicon To Mainstream RF Markets And Applications

    MACOM Technology Solutions Holdings, Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and lightwave semiconductor products, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, recently announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM’s use across an array of RF applications.

  6. ASE And Cadence Deliver First System-In-Package EDA Solution Tailored For ASE’s High-Performance, Advanced IC Package Technologies

    Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., recently announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages 

  7. Movellus Launches With Focus On Expanding Digital Design Tools To Implement Analog Functionality

    Movellus introduced itself recently as a provider of software and IP innovations that expand digital design and verification tools to automatically implement functionality that has traditionally required months-long custom analog design

  8. New NXP CAN Transceiver Family Secures CAN Communications Without Cryptography

    NXP Semiconductors (NASDAQ: NXPI), the world’s largest supplier of automotive semiconductors, today announced a new secure CAN transceiver family that offers a seamless, efficient solution for secure CAN communications — and does not require software or cryptography

  9. Alpha And Omega Semiconductor Announces The Newest Generation Of XSPairFET™ In DFN 3.3x3.3 Package

    Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters

  10. Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production

    Hua Hong Semiconductor Limited, a global leading pure-play 200mm foundry, recently announced the successful mass production of its second-generation 90nm eFlash (90nm G2 eFlash) process platform, which has further enhanced the Company's technical capabilities and competiveness