Latest Headlines

  1. Cypress Achieves Aerospace-Grade QML Certification For Its 65nm And 40nm SRAM Devices At UMC
    11/15/2017

    Cypress Semiconductor Corp. (CY), the market leader in advanced embedded system solutions including radiation-hardened memories, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that Cypress’ 65nm and 40nm technology platforms are the industry’s first to achieve Qualified Manufacturers List (QML) certification for their advance product flows. The next-generation 144-Mbit Quad Data Rate (QDR) II+, 144-Mbit QDR IV and 16-Mbit Asynchronous SRAM devices, manufactured at UMC’s Fab

  2. Seoul Semiconductor Introduces A Acrich Based Compact LED Driver With 5X The Power Density Of Conventional Drivers
    11/15/2017

    Seoul Semiconductor, a global leader and innovator of LED products and technology, has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers

  3. Inside Secure Unveils Industry’s First Root-Of-Trust Solution Based On RISC-V Processor
    11/15/2017

    Inside Secure, at the heart of security solutions for mobile and connected devices, recently announces the launch of its Silicon IP Programmable Root-of-Trust Engine, the industry’s first RISC-V -based platform security solution

  4. Gigaphoton Announces New Roadmap For DUV Light Source
    11/14/2017

    Gigaphoton Inc. (Head Office: Oyama, Tochigi; President & CEO: Katsumi Uranaka), a leading manufacturer of light sources used in semiconductor lithography, announced its intention to draw up a new roadmap with the aim of improving the availability of the equipment, and also to respond to the needs of the semiconductor chip manufacturers who are being confronted with increasingly high demands

  5. Toshiba Electronic Devices & Storage Corporation Releases Medium Voltage, High Capacity Photorelay In Small Package
    11/14/2017

    Toshiba Electronic Devices & Storage Corporation recently announced the launch of “TLP3145,” a new photorelay in a small 2.54SOP4 package with an off-state output terminal voltage of 200V and an on-state current of 0.4A. Volume shipments start today

  6. Renesas Electronics Delivers Advanced Security For Industrial Internet Of Things With Enhanced RX65N/RX651 Microcontrollers
    11/13/2017

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced the expansion of its popular RX65N/RX651 Group of microcontroller (MCU) lineup that addresses advanced security needs for connected devices operating in industrial automation, building automation, and smart metering systems

  7. IEEE Standards Association (IEEE-SA) And TRON Forum Sign Agreement To Advance IoT Development And Interoperability
    11/10/2017

    IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Standards Association (IEEE-SA), recently announced the signing of an agreement with the TRON Forum, a forum that supports a development project called TRON Project that addresses real-time architecture for embedded systems

  8. Ardent Concepts Releases User-Friendly Design Update To Its TR Series Multicoax Connector
    11/9/2017

    Ardent Concepts, Inc., a leading designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications has released a new design of its 20, 40, & 70 GHz Straight Mount TR Multicoax series connector

  9. Invensas DBI Technology Now Available At SMIC
    11/8/2017

    Semiconductor Manufacturing International Corporation (“SMIC”), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Invensas, a wholly owned subsidiary of Xperi Corporation (“Xperi”), recently announced the establishment of Invensas’ Direct Bond Interconnect (DBI) technology at SMIC’s Avezzano facility

  10. Evoqua Water Technologies Announces Closing Of Initial Public Offering And Full Exercise Of Underwriters’ Option To Purchase Additional Shares
    11/7/2017

    Evoqua Water Technologies Corp. (“Evoqua Water Technologies” or the “Company”) announced the closing of its initial public offering of 31,944,443 shares of its common stock at a public offering price of $18.00 per share, which included 4,166,666 shares sold upon full exercise of the option to purchase additional shares granted to the underwriters by certain stockholders of the Company.